TO-263
The Double Decawatt Package,[1][2] D2PAK, SOT404 or DDPAK, standardized as TO-263,[3] is a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola.[1][2] They are similar to the earlier TO-220-style packages intended for high power dissipation[2][4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals.[1][2]
- A pair of MOSFETs in the surface-mount package D2PAK.
- A TO-220 package compared to a D2PAK package.
Dimensions
Variants
Texas instruments has a smaller version of the TO-263: the TO-263 THIN. The height of the TO-263 THIN is 2 mm instead of the standard 4.5 mm.[2][5]
See also
References
- ^ a b c d "D2PAK or DDPAK - Double Decawatt Package". eesemi.com. Retrieved 2021-06-29.
- ^ a b c d e f "TO-263 Component Package". blog.mbedded.ninja. 2015-04-07. Retrieved 2021-06-29.
- ^ a b "TO-263 Standard". JEDEC. Retrieved 2021-06-29.
- ^ "D2PAK (TO-263) MOSFET Power Discrete". Amkor Technology. Retrieved 2021-06-29.
- ^ "AN-1797 TO-263 THIN Package" (PDF). Texas instruments (pdf). Retrieved 29 June 2021.
External links
- Package information from Fairchild
- Mechanical drawings from National Semiconductor
- Mechanical drawings of D2PAK from ON Semiconductor
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- SOT / TSOT
- TO-3 (TH / Panel)
- TO-5 (TH)
- TO-8 (TH)
- TO-18 (TH)
- TO-39 (TH)
- TO-66 (TH / Panel)
- TO-92 (TH)
- TO-126 (TH / Panel)
- TO-202 (TH / Panel)
- TO-220 (TH / Panel)
- TO-247 (TH / Panel)
- TO-251 (IPAK) (SMT)
- TO-252 (DPAK) (SMT)
- TO-262 (I2PAK) (SMT)
- TO-263 (D2PAK) (SMT)
- TO-268 (D3PAK) (SMT)
- TO-273 (Super-220) (SMT)
- TO-274 (Super-247) (SMT)
- DFN
- DIP / DIL
- Flat Pack
- MSOP
- SO / SOIC
- SOP / SSOP
- TSOP / HTSOP
- TSSOP / HTSSOP
- ZIP
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